ANSYS Icepak

Cooling Simulation Software for Electronic Components


Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

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Creotech Instruments Creates Next-Generation Microsatellites with Multiphysics Simulation

Creotech implements leading-edge methodologies developed by the European Space Agency to design, assemble and integrate critical equipment that meets space standards.Repairing orbiting microsatellites is impossible due to extreme logistical challenges. Satellite engineers must ensure that equipment is space-proven and extremely reliable before launch. Creating individual satellite components generates high costs, requiring satellite integrators to meet stringent design requirements and satisfy high production process standards. Creotech Instruments’ use of multiphysics simulation effectively addresses these complex challenges.

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Introduction of Thermal Mesh Fusion

Thermal Mesh fusion enables automated partitioning of the target geometry into subdomains of similarity and then applies the most appropriate mesher to the subdomain. These are then re-combined.

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